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YSH20
YSH20 is a high-speed, high-precision, flip chip placement machine with a mounting capacity of up to 4500UPH (0.8 seconds/Unit), and has top-notch mou
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Description
Specification
| YSH20 | |
|---|---|
| Object substrate size measurement |
L50 x W30 ～ L250 x W200 mm The maximum support for substrates is L340 x W340 mm. |
| Form of component supply | Chip (6/8/12 inch flat ring), honeycomb tray, tape tray (width 8/12/16 mm) |
| Power Specifications | Three phase AC 200/208/220/240/380/400/416V: ± 10% 50/60Hz |
| Supply gas source | 0.5MPa or above, in a clean and dry state |
| Dimensions (excluding protrusions) | L 1400 x W1820 x H1515 mm (main body only) L 1400 x W2035 x H1515 mm (with YWF chip supply device) |
| weight | Approximately 2470 kg (main body only) Approximately 2780 kg (with YWF chip supply device) |
- Please consult for detailed information.
- Specifications and appearance are subject to change without prior notice.
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