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YSB55w
YSB55w achieves about 3 times higher productivity and about 2 times higher precision mounting than previous models. Launching a 'semiconductor assembl
Product details
Description
Specification
| YSB55w | |||
|---|---|---|---|
| Object substrate | L240×W200～L50×W50mm | ||
| substrate thickness | 0.2～3.0mm | ||
| Transport Direction | Left to Right (Optional: Right to Left) | ||
| Mounting accuracy | ±5µm（3σ） | ||
| Mounting ability | 13000 UPH (under optimal conditions including actual production processing time) | ||
| Supply form of parts | 12 inch chip | ||
| Object components | □2～30mm | ||
| Power Specifications | Three phase AC 200/208/220/240/380/400/416V ± 10% 50/60Hz | ||
| Supply gas source | Above 0.45Mpa | ||
| Overall dimensions | L2090 × D1866 × H1550mm (when equipped with a chip supply device) | ||
| weight | About 3500kg (when equipped with a chip supply device) | ||
- Specifications and appearance are subject to change without prior notice.
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