
This machine is suitable for longitudinal slitting of various roll shaped substrates such as PVC, BOPP, CPP, BOPET, etc
Performance and features:
1. This machine adopts Siemens PLC centralized communication control and human-machine interface system from Germany. According to the production process requirements, real-time input or adjustment of parameters and monitoring of equipment status are carried out. The system has functions such as startup buffering, parking anti loosening, meter and length measurement, as well as detailed self diagnostic functions. It is easy to operate and maintain.
2. Translational winding: During the winding process, as the winding diameter increases, the winding workstation automatically translates outward in the horizontal direction, ensuring the stability of the geometric parameters of the winding throughout the entire winding process, thereby achieving high-quality slitting and winding.
3. The traction and winding are controlled and driven by Siemens servo system, and the PLC automatically controls the winding tension based on process requirements and set tension and taper, real-time winding diameter, cutting speed, and cutting width.
4. Non axis center winding method, multi station winding (4 stations, 2 stations on the inner and outer sides), each winding station has a separate drive and tension control system, and each winding unit has an independently operated roller system.
5. The winding motors of adjacent workstations can be driven in series to achieve the winding of materials with large diameters and widths.
6. The loading and unloading of raw materials adopts an air top shaftless clamping and hydraulic lifting structure, which is convenient and fast for loading and unloading.
7. The unwinding tension control adopts the Mitsubishi fully automatic tension control system from Japan, which keeps the unwinding tension constant and can control the taper according to the process requirements. The correction adopts the American automatic correction system to ensure the correct feeding position of the substrate.



