CMI165 Surface Copper Tester

Handheld surface copper thickness gauge with temperature compensation function

The Oxford Instruments CMI165 series is used for testing PCB copper foil at high/low temperatures, quantitative testing of copper thickness after etching or leveling, and measurement of surface copper thickness after electroplating. Relevant copper foil incoming inspection is carried out before PCB drilling, cutting, electroplating and other processes.

Instrument features:

1. Apply advanced micro resistance testing technology that complies with the EN14571 testing standard. The SRP-T1 probe consists of four probes, with AB as the positive electrode and CD as the negative electrode; When measuring, there will be a small resistance in the current from the positive pole to the negative pole. The surface copper thickness can be accurately and reliably obtained through the functional relationship between the resistance value and the thickness value, which is not affected by the insulation board layer and the copper layer on the back of the circuit board

2. The worn SRP-T1 probe can be replaced by itself and is a patented product of Oxford Instruments

3. The illumination function of the instrument and the protective cover of the SRP-T1 probe facilitate accurate positioning during measurement

4. The instrument has temperature compensation function, and the measurement results are not affected by temperature

5. The instrument is pre calibrated by the factory

6. The test data is transmitted at high speed through USB 2.0 and can be saved as an Excel file

7. The instrument is powered by ordinary AA batteries