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Sensor signal processor chip BCPA1100
Product Introduction: The piezoresistive MEMS sensor signal conditioning chip is a high-precision analog-to-digital converter designed for differentia
Product details
The piezoresistive MEMS sensor signal conditioning chip is a high-precision analog-to-digital converter designed for differential resistance bridge or half bridge sensor signals. It can provide digital or analog measurement output signals through a single wire interface. The chip integrates a built-in temperature sensor and can output temperature information that has been digitally compensated. It also has a digital signal processing circuit that can perform digital compensation on the measurement results of the sensor, including first-order or second-order compensation for signal offset, sensitivity, temperature drift, and nonlinearity. It has high integration and few external components; One line digital configuration calibration interface; Support large-scale calibration operations, digital and analog output. To provide convenient and accurate measurement results for sensors, once calibrated, it can output: 0-1V absolute voltage signal, proportional voltage signal, temperature or digital signal of sensor bridge.
Product Service
Provide development kits;
Support large-scale calibration operations;
Large quantities can be customized with chips.
Key Features
1. No need for external compensation components;
2. PC implements chip configuration and calibration through a one wire digital interface;
3. High precision, high accuracy (± 0.1%) FSO@-25 —+85℃； ±0.25% FSO@-40 —+125℃）；
4. Rapid and accurate single channel calibration;
5. Built in automatic compensation temperature sensing circuit, and external temperature sensing components can also be used for temperature measurement;
6. Single line interface with selectable output modes (can be set as rail to rail analog voltage output, 0~1V analog voltage output, digital output, and PWM signal output);
7. Suitable for battery powered applications;
8. Small package size: MSOP10.
Product Service
Provide development kits;
Support large-scale calibration operations;
Large quantities can be customized with chips.
Key Features
1. No need for external compensation components;
2. PC implements chip configuration and calibration through a one wire digital interface;
3. High precision, high accuracy (± 0.1%) FSO@-25 —+85℃； ±0.25% FSO@-40 —+125℃）；
4. Rapid and accurate single channel calibration;
5. Built in automatic compensation temperature sensing circuit, and external temperature sensing components can also be used for temperature measurement;
6. Single line interface with selectable output modes (can be set as rail to rail analog voltage output, 0~1V analog voltage output, digital output, and PWM signal output);
7. Suitable for battery powered applications;
8. Small package size: MSOP10.
1. Power supply voltage: 4.5-30VDC;
2. Built in temperature sensor measuring range: -40 ℃ -150 ℃;
3. The consumed current depends on the specific settings, and the average current at the highest update rate is only 1.5mA
4. Sampling rate: 2KHz
5. Input signal range: 1-100mV;
6. Wide working temperature range: -40~150 ℃;
7. A fast power on measurement cycle can reach 1.73mS at an internal 2MHz clock.
2. Built in temperature sensor measuring range: -40 ℃ -150 ℃;
3. The consumed current depends on the specific settings, and the average current at the highest update rate is only 1.5mA
4. Sampling rate: 2KHz
5. Input signal range: 1-100mV;
6. Wide working temperature range: -40~150 ℃;
7. A fast power on measurement cycle can reach 1.73mS at an internal 2MHz clock.
Signal conditioning of pressure sensor chip.
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