HITO BTB Fully Automatic Solder Paste Printing Machine
Features:

Screw servo platform positioning

Unique adaptive scraper system

Flexible, self balancing cleaning system

Stable and accurate PCB transportation system

Flexible side pressure system can overcome PCB size deviation

Fully automatic frame positioning

Humanized operation interface (mechanical automatic teaching system)

Printing accuracy ± 0.18mm
Repetitive accuracy ± 0.008mm
Printing cycle (excluding printing time) ＜ 7.8S
Mesh frame size 470mm * 380mm * 737mm * 737mm
Mesh frame fixed cylinder Air Valve
Frame adjustment automatic
Scraper pressure closed-loop pressure control system (standard)
Platform adjustment range X: ± 4mmY: ± 6mm

Platform adjustment angle ± 2 º
PCB (printing) size: 50 * 50-400 * 340mm
PCB thickness 0.4-5mm
Transportation direction
Left right; Right left; Left left; Right right L-R, R-L, L-L, R-R
transmission speed

Stepper motor, programmable adjustable 100-1500mm/s
PCB weight: 0-3kg
Transfer height 900 ± 40mm
Conveying width 50-340mm
SMEMA Interface Standard
PCB delamination

Three stage delamination method
Demoulding speed 0.01~20mm/s
Demoulding distance 0-20MM
Solder paste detection 2D detection (standard)
Voltage requirements for working conditions
AC:220±10％,50/60HZ-1 ￠
Power 3KW
Pressure requirement: 4.5~6Kg/cm2
Appearance size 1140 * 1360 * 1500mm