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Mirror appearance defect detection system
Mirror appearance defect detection system
Product details
Product Introduction:
Automatic screening and measurement of surface defects on wafers, substrates, and precision optical components
Detection object:
Wafer, cover plate, substrate, precision optical components (flat crystal, prism, glass slide, etc.)
Targeting industries:
Semiconductor wafer production3CCover plate and optical substrate, optical polishing processing
technical parameter
Technical parameters:
Ø Maximum detection aperture for defects300X200mm(Coverage)8Inch wafer, customizable12Inch wafer machine)
Ø The highest resolution for defect detection0.5um
Ø Defect detection types: pockmarks, scratches, textures, discoloration, broken edges, etc
Ø Automatic defect recognition and size measurement
Ø Manual loading and unloading, supporting the development of semi-automatic and automatic loading and unloading
Ø Technical features
Ø Adopting multi-mode imaging ensures that various types of defects can be detected
Ø You can follow20/10、40/20、60/40Standard measurement and judgment of defects
Ø Software and hardware can be customized according to actual sample testing requirements
Can be equipped with the ability to detect three-dimensional warping of the substrate
◆ Measurement examples
Pitts and scratches Surface texture
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