1: Cross section of SiC grinding paper l 2: Cross section of plywood l 3: Coaxial polymer fibers (soluble in water) prepared at -120 ° C l 4: Oil shale (nanopores) exhibited by Leica EM TIC 3X (spin transfer stage) treatment, with a total sample diameter of 25 mm

Replicable results

The Leica EM TIC 3X three ion beam cutting instrument can prepare cross-sections and polished surfaces for use in scanning electron microscopy (SEM), microstructure analysis (EDS, WDS, Auger, EBSD), and AFM research.

With Leica EM TIX 3X, you can achieve high-quality surface treatment on almost any material at room temperature or frozen conditions, displaying the internal structure of the sample as close to its natural state as possible.

Bringing unprecedented convenience!

efficiency

What is truly important for the efficiency of an ion beam grinder is to have both excellent quality results and high output. Compared with the previous version, the new version not only doubles the cutting speed, but also optimizes the preparation quality and shortens the working time with its unique three ion beam system. Up to 3 samples can be processed at once, and cross cutting and polishing can be performed on the same stage.

The workflow solution can safely and efficiently transfer samples to subsequent preparation instruments or analysis systems.

Flexible system - always ready to meet your needs

With a flexible selection of stages, Leica EM TIC 3X is not only an ideal equipment for high-yield processing, but also suitable for laboratories commissioned for testing. According to your needs, the following interchangeable stages can be selected for personalized configuration of Leica EM TIC 3X:

• Standard carrier platform
• Diverse product carrier platform
• rotatable stage
• Cooling stage or
• Vacuum freezing transfer docking station

Used for preparing standard samples, high-yield processing, and preparing samples that are abnormally sensitive to high temperatures under low temperature conditions, such as polymers, rubber, or biomaterials.

Environmental Control Workflow Solution

With the VCT docking station interface compatible with Leica EM TIC 3X, an excellent planing workflow can be provided for samples that are susceptible to environmental influences and/or low-temperature samples, including

• Biomaterials,
• Geological materials
• Or industrial materials.

Subsequently, these samples will be transferred to our coating system EM ACE600 or EM ACE900 and/or SEM system under inert gas/vacuum/freezing conditions.

Standard workflow solution - synergizing with Leica EM TXP

Before using Leica EM TIC 3X, mechanical preparation work is usually required to get as close as possible to the area of interest. Leica EM TXP is a unique target surface polishing system developed for sample cutting and polishing, fully prepared for subsequent technical processing of instruments such as Leica EM TIC 3X

Leica EM TXP is professionally designed to prefabricate samples using sawing, milling, grinding, and polishing techniques. For challenging samples that require precise positioning and are difficult to prepare, it can provide excellent results, making processing easy and simple.