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Horizontal thinning machine
Series: Thinning Machine Product Model: FD-42003A
Product details
FD-200WHHigh speed transverse thinning machine
Scope of application:
Very suitable for products with high workpiece hardness, ultra-thin thickness, and high machining accuracy requirements. For example:LEDsapphireRapid thinning of substrates, quartz chips, silicon wafers, ceramic wafers, tungsten steel wafers, and various metal materials.
Principle of high-precision transverse grinding machine equipment:
1.This series of horizontal thinning grinding machines are fully automatic precision grinding equipment, powered by vacuumSuction cup or electromagnetic suction cupThe adsorption workpiece rotates in the opposite direction to the grinding wheel rotation,The grinding wheel swings back and forth. This method has low grinding resistance, no damage to the workpiece, and uniform grinding with high production efficiency.
2.The equipment can automatically align the tool, detect the actual grinding torque, and adjust the workpiece grinding speed, thereby preventing deformation and damage caused by excessive pressure during the workpiece grinding process, and automatically compensating for the thickness and size of the grinding wheel wear.
Characteristics of high-precision transverse grinding machine equipment:
1.Can make the diameter200The thickness of the chip is reduced to0.08mmThick and unbreakable. not only ... butParallelism and flatness can be controlled within±0.002mmWithin the scope.
2.High thinning efficiency,LEDSapphire substrate can be thinned at a maximum grinding speed per minute48Microns. The maximum grinding speed per minute for silicon wafers can reduce thickness250Microns.
3.The series of grinding machines adoptsCNCProgram control system, touch screen operation panel.
Equipment picture:
Technical parameters:
|
model |
FD-200WH |
|
Diamond grinding wheel size |
diameter200*H25 |
|
Maximum size of workpiece |
diameter200mm |
|
Workpiece speed (adjustable) |
0---1000rpm |
|
Grinding wheel speed (adjustable) |
0---2000rpm |
|
Grinding wheel motor power |
1.5kw.380V， 3 phases |
|
Suction cup spindle motor power |
0.75kw.380V， 3 phases |
|
Control accuracy (parallelism) |
1um (diameter 100mm) |
|
External dimensions |
1200*550*1550 |
|
weight |
760kg |
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