1、 Equipment Overview
A high-performance anaerobic oven can perform heat treatment at temperatures up to 500 ℃ in an atmosphere with oxygen concentrations as low as 500ppm. This makes the series very suitable for MLCC and LTCC degreasing, as well as various antioxidant heat treatments. The high-temperature anaerobic oven adopts a proprietary chamber structure and sealing technology, which has excellent airtightness and temperature uniformity, while also ensuring higher stability and reproducibility. Simultaneously using an external cooling mechanism with circulating cooling water can achieve rapid cooling without affecting the atmosphere inside the furnace, thereby shortening the processing time.
Scope of Application
Suitable for curing semiconductor wafers (photoresist PI, PBO curing), IC packaging (copper substrate, silver paste, silicone, epoxy resin), glass substrate baking, high-precision annealing treatment, etc.
| Application scope |
Heating purpose |
Heating object |
| Electronic components |
Defatting (adhesive sintering), curing |
Ceramic materials/plates, MLCC (multi-layer ceramic capacitors), LTCC (low-temperature co fired ceramics), ceramic O2 sensor, ferrite core, FPC (flexible printed circuit), common mode noise filter, thermistor |
| Precision raw materials |
Degreasing, curing, annealing, sintering, drying |
Wafer, silicon wafer, silicon carbide ceramic, electrostatic suction cup, aluminum nitride, optical lens, flexible substrate, rechargeable battery, electrode material, wire harness (copper wire), catalyst, forged product |
3、 Product parameters
model |
YH-OXY-500C |
Stable range of work |
Room temperature -500 ℃ |
Ultimate oxygen content |
Within 50PPM |
Cooling method |
Water cooling and cooling |
Size | |||
Working Size |
H600*W600*D600mm |
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Studio | |||
Number of studios |
A single studio, which can be divided into 4 levels |
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internal configuration |
Configure 4 stainless steel support shelves, wrapped with stainless steel mesh plates, and adjustable shelf spacing |
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Air transport heating system | |||
heating rate |
Heating rate 8-10 ℃/min, controllable constant temperature time |
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cooling rate |
Cool down from 500 ℃ to 100 ℃ for ≤ 50 minutes (the time may vary depending on the temperature of the cooling water) |
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Nitrogen filling device |
Automatically control the nitrogen filling process to ensure that the product is heated in an anaerobic or low oxygen concentration environment, preventing oxidation of the product |
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Electrical appliances | |||
Over temperature protection device |
Independent intelligent temperature controller, when the actual detected temperature exceeds the set value of the over temperature protector, automatically cuts off the heating power supply, providing dual protection |
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Protection system |
The equipment has phase loss detection, self diagnosis, leakage protection, over temperature protection, automatic parameter saving in case of emergencies, sensor self diagnosis, overload protection, grounding protection, fan overheating protection, battery access control, and operator error prevention setting protection |
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Usage environment |
Environmental conditions: Temperature between 5-40 ℃: Humidity ≤ 85% R.H 电源: AC380V,50HZ Usage environment: No strong vibration, no strong magnetic field influence, no corrosive gas, no dust. Air pressure 86~106Ka Nitrogen source: 0.8MPA, 100L/MIN Wall distance ≥ 500mm |
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