Shenzhen Minglei Laser Equipment Co., Ltd
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    No. 2 Lixin North Road, Qiaotou Community, Fuyong Town, Bao'an District, Shenzhen
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FPC board laser cutting machine
Using high-performance ultraviolet lasers with good beam quality, small focused spot, and uniform power distribution, it can process various highly co
Product details

FPC板激光切割机

Model Introduction


  Using high-performance ultraviolet lasers with good beam quality, small focused spot, and uniform power distribution, it can process various highly complex circuit boards, flexible circuit boards, and soft hard composite boards. By reducing the power through pulses, it is possible to perform FPC QR code processing, achieving a dual-purpose FPC cutting and coding machine. Meet the high yield and efficiency requirements of cutting, coding, processing, and mass production in the circuit board industry.


Product Features


  Using laser cutting is convenient and fast, shortening the delivery time;

  Good cutting quality, minimal deformation, smooth appearance, and beautiful appearance;

  Perfect integration with automated production lines to achieve efficient online production;

  Can cut any irregular and complex contour;

  By reducing the power through pulses, FPC can be processed with QR codes, achieving dual use for one machine;

  Adopting a work platform mobile and laser head fixed mode, it has higher accuracy and stability than the traditional laser head mobile mode.

  Integrating numerical control technology, laser technology, software technology and other optoelectronic technologies, it has high precision and flexibility.


Equipment parameters:

FPC板激光切割机参数

Application scope:

  

FPC soft board cutting, soft hard combination board cutting, FPC cover film cutting, PCB hard board cutting and splitting within 1.0mm, SMT industry board splitting and QR code marking process, fingerprint recognition chip cutting, camera module laser cutting, circuit board cutting with soldered components, PI protective film cutting, glass cutting, drilling, ceramic cutting, drilling, marking, silicon wafer cutting, copper foil cutting.

  

■ Machine sampling diagram

FPC板激光切割机机器样品图

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