FD7004PA Silicon Wafer Grinding Machine

Main purpose:

This equipment is mainly used for single-sided high-precision grinding and polishing of thin precision parts such as sapphire substrates, sapphire epitaxial wafers, silicon wafers, ceramics, quartz crystals, and other semiconductor materials.

Equipment features: 1. This equipment is a single-sided precision grinding device, using advanced mechanical structure and control methods, with high grinding efficiency and stable operation.

2. The whole machine adopts PLC+touch screen control system, with simple and convenient equipment parameter setting and operation, and high system stability.

3. The main motor adopts variable frequency speed control to achieve soft start and soft stop of the host, reduce equipment operation impact, and minimize workpiece damage.

4. The grinding pressure of the workpiece is pressurized by a cylinder and controlled by an electrical proportional valve to achieve closed-loop pressure control, ensuring extremely high pressure accuracy and stability.

5. The upper pressure plate adopts an active driving method to ensure the uniformity of grinding and processing at each workstation while ensuring the product grinding rate.

Both the grinding disc and the upper pressure disc are equipped with cooling water cooling function, which reduces the deformation of the grinding disc surface while ensuring the maximum efficiency of the grinding fluid.

7. The device comes with a built-in panel repair machine, which can ensure a flatness of 0.01mm after panel repair.

Equipment parameters:

Equipment picture:

The grinding and polishing effect of this device: