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Etchlab 200 reactive ion etching machine
Etchlab 200 reactive ion etching machine
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product overview
The Etchlab 200 reactive ion etching machine is a basic and economical equipment for developing dry etching processes, which can be gradually upgraded to a complete reactive ion etching equipment RIE, suitable for all process gases and process requirements.
Etchlab 200 features modular design, process stability, and ease of use, allowing for direct placement of wafers. Etchlab 200 is suitable for a wide range of etching processes, such as etching silicon, silicon oxide, metals, III-V compounds, and polymers.
The long-term validated modules in the single-crystal reaction chamber can meet various requirements, including heavy etching tasks. According to the specified etching task and plasma chemical gas requirements, the reaction chamber can be configured with different gas systems. All important parameters of the equipment are automatically controlled.
The lower electrode can accommodate wafers with a diameter of 4 inches to 8 inches. The lower electrode is water-cooled or the temperature is controlled between 10 ° C and 80 ° C through an optional circulating cooler. The 13.56 MHz RF power source of the lower electrode generates plasma (RIE mode). Different plasma impedances are automatically matched to the 50 ohm output of the RF generator. At the same time as generating plasma, a 13.56 MHz RF power loaded onto the lower electrode simultaneously generates a DC self bias. The wafer with a diameter of 100 mm to 200 mm is directly placed on the lower electrode.
The vacuum system includes turbo molecular pumps and mechanical front-end pumps, meeting the pressure flow requirements required for RIE processes. The automatic throttle valve maintains the pressure inside the reaction chamber independently of the gas flow rate. Mass flow meters (MFCs) provide highly stable airflow. This can achieve precise and reproducible etching conditions.
The system has advanced hardware and software control systems and adopts a client server structure. A mature and reliable remote field controller (RFC) controls all components in real-time through a serial fieldbus (Interbus). The basic security interlock is implemented by this RFC.
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