Leica metallographic microscopeDM12000MBy utilizing optical principles, the sample under test is placed on the observation platform of a microscope, and the image of the sample is magnified into the eyepiece of the microscope through reflection or transmission of light. Under the characteristics of light scattering and absorption by the sample, the imaging phenomenon of the sample constantly changes with the variation of parameters during imaging. Observers can determine the microstructure and organization of the sample based on these changes.

DM12000M Leica metallographic microscope features:

1、 The brand new optical design provides macro mode rapid initial inspection and tilted ultraviolet path function (OUV, tilted ultraviolet observation mode), which not only improves resolution but also increases the production capacity for inspecting 12 inch (300mm) silicon wafers. The new integrated design of LED lighting technology is integrated into the microscope, with low thermal radiation and integrated technology inside the body ensuring ideal airflow outside the body.

2、 The DM12000M Leica metallographic microscope reduces inspection time and improves inspection efficiency. The automatic focusing attachment for transmission light inspection illumination can be used in conjunction with all reflection light illumination observation methods, even including dark field and differential interference phase contrast observation. Realize fast and accurate autofocus, and even find the focal plane accurately in real time when switching observation modes.

3、 Two types of lighting devices are available, the universal type and the high numerical aperture type. Provide suitable illumination for FPD and MASK board inspection, and can be equipped with polarizing mirrors to achieve simple polarized observation of projected light. High contrast, higher resolution, and higher magnification inspection are fluorescence observation methods used for photoresist residue inspection. The fluorescence spectrometer module UV optical system can provide higher contrast and resolution, with a resolution of up to 0.12 μ m.

4、 There are various fluorescent methods available, such as U.B.G, for residual light particles and OLED inspection. Convenient communication interface for controlling and obtaining parameters of microscope magnification and aperture stop. RS232C is used for internal inspection of wafers, devices, and even solder joints. Near infrared observation accessories come standard with an RS232C interface, making it possible to control the electric part of the microscope with a PC and enabling several microscopes on the process line to work in the same set state.

5、 Including specialized infrared objective lenses and other accessories, it corrects aberrations of light from visible to near-infrared bands, used for deep or internal inspection of ICs, and can achieve comprehensive inspection of WAFER BUMP. The automatic linewidth CD measurement accessory uses sub-pixel technology to achieve highly accurate CD measurement.

6、 The low-energy energy-saving design greatly extends the service life and conforms to the concept of green environmental protection. The one click control design allows users to easily complete magnification conversion and related lighting and contrast effects.