The equipment consists of a heat sink loading device driven by a control circuit, a heat dissipation paste loading device, an IC transistor loading device, a screw feeding device, and a fastening device. The heat sink loading device is set on the base and has a sliding track for the heat sink to slide along, allowing the heat sink to slide along the sliding track to the corresponding workstation; The heat dissipation paste loading device is driven by a horizontally and vertically movable motion structure to dip the dipping part into the heat dissipation paste, and apply the heat dissipation paste to the heat sink; The IC transistor loading device separates the IC transistors and sends them one by one to the workstation. The IC transistors are absorbed by the adsorption part set on the moving structure and installed on the heat sink; Align the screw outlet of the screw feeding device with the fixing hole of the heat sink on the workstation, and send the screws one by one to the fixing hole; The fastening device is located vertically above the fixed hole, and the screw is tightened in the fixed hole. The entire process can be completed in just 2.5-3 seconds.

1. Can replace 5 workers and significantly reduce operating costs

2. Reduce the loss of raw materials

3. Significantly improve work efficiency

4. Improve the quality of production

5. Enhance the overall image of the enterprise

6. Enhance the comprehensive competitiveness of enterprises