1. Product Introduction
An anaerobic oven uses inert gases such as nitrogen or argon to replace the air inside the oven, creating an anaerobic environment and keeping the oxygen level below 100PPM to protect the product from oxidation under high temperature conditions. This makes the series very suitable for MLCC and LTCC degreasing, as well as various antioxidant heat treatments. The anaerobic oven adopts a proprietary chamber structure and sealing technology, which has excellent airtightness and temperature uniformity. At the same time, an external cooling mechanism with cooling water circulation can be selected, which can achieve rapid cooling without affecting the atmosphere inside the furnace, thereby shortening the processing time. Suitable for curing semiconductor wafers (photoresist PI, PBO curing), IC packaging (copper substrate, silver paste, silicone, epoxy resin), glass substrate baking, high-precision annealing treatment, etc.

2. Product Features
●The box is welded with full argon arc welding to ensure continuous sealing of the box
●Automatic nitrogen charging system
●The exterior is coated with baking paint
●Configure stainless steel shelves
●High temperature resistant silicone rubber door seal
●Multiple protection devices (over temperature protection, motor protection, electrical protection)

3. Optional features
●Install HEPA high-efficiency filtration system
●Oxygen content analyzer
●Water cooling cooling system
●Customized fixtures
●Touch screen integrated control
●Paperless recorder
●485 communication or Ethernet communication
●Externally made of stainless steel material

4. Product parameters

5. Non standard customization
For the packaging industry, after cleaning the bracket, it is dried and customized with non-standard double door sizes
Customized multi door and multi control nitrogen charging oven for IC packaging.